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This position is for a semiconductor packaging research scientist with a focus on development related to quantum technologies. The packaging scientist will collaborate with a team of engineers and scientists on a wide variety of quantum packaging applications such as exploratory bumping technologies, high density flex cabling, and will drive collaborations between process engineers, integrators, and technical leads. The candidate will be part of a team encompassing the IBM Microelectronics Research Lab (MRL), Albany Nanotech Lab (ANT), and the Quantum Assemble Lab (QAL). These facilities provide world class 200/300 mm wafer scale fabrication and packaging services to multiple clients including Semiconductor Development, Quantum Computing, Artificial Intelligence, and government programs.
Familiarity with semiconductor and packaging processing is essential. Capability of innovating new processes and process flows using the semiconductor packaging tool set is also key. The goal is to drive improvements and establish path finding for future innovative scaling approaches.
Familiarity with semiconductor and packaging processing for quantum devices. An in-lab, firsthand approach is necessary. Good organizational, communication, and presentative skills are imperative.