Senior Signal and Power Integrity Engineer
Microsoft
Senior Signal and Power Integrity Engineer
Raleigh, North Carolina, United States
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Overview
The Microsoft Silicon team is transforming the ways people communicate, create, and collaborate through the devices and components we develop. We’re a growing team of engineers on a mission to develop revolutionary designs and provide leading edge silicon device solutions to power Microsoft computer and datacenter requirements. Microsoft systems including Azure, Xbox and HoloLens incorporate our internally developed silicon components. Our team is creative and resourceful; we value growth and learning. We want to amplify your abilities so you can do your best work. Join us, and together we’ll turn groundbreaking hardware designs into reality!
We are seeking a Senior Signal Integrity and Power Integrity (SIPI) engineer to work in the Microsoft Azure hardware engineering team responsible for developing advanced power delivery and signaling solutions for High Performance Computing (HPC) silicon designs. In this role, you will be responsible for driving the completion of SIPI design solutions supporting overall SOC performance interfacing with silicon, packaging, and system design teams.
Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
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Qualifications
Required/Minimum Qualifications:
7+ years of related technical engineering experience
o OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience.
o OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience or internship experience.
o OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field.
1+ year of experience in silicon/package/system signal integrity and power delivery.
3+ years of experience in advanced packaging technologies as it relates to Signal and Power integrity.
Other Requirements:
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings:
Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Preferred/Additonal Qualifications:
· 11+ years technical engineering experience
o OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience
o OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience
o OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience.
- Masters degree with minimum 5+ years of experience in silicon/package/system signal integrity and power delivery.
- Experience in the field of Signal and Power Integrity and delivery, System design, IP design with knowledge on product development with minimum 5 years’ experience in design and electrical modelling.
- Knowledge in the field of end to end system SIPI Design and Architecture.
- Industry knowledge, trends and landscape of technologies to drive development across Silicon-IP, Advanced packaging, Substrate technology, Board technology and Platform design.
- MSEE degree with 10 years’ experience in silicon packaging products development.
- Experience with high-speed signal design and/or power integrity modelling for HPC products.
- Experience with Foundry Silicon technologies, OSAT technologies and Substrate technologies.
Silicon Engineering IC4 - The typical base pay range for this role across the U.S. is USD $117,200 - $229,200 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $153,600 - $250,200 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay
Microsoft will accept applications for the role until December 23, 2024
Responsibilities
We are seeking an engineer to deliver premium-quality designs once considered impossible. We are responsible for delivering cutting-edge, custom IP and SoC designs that can perform complex and high-performance functions in an extremely efficient manner.
- SIPI engineer for compute and AI SoCs and platforms – Implement strategies for end-to-end power delivery design and signal integrity design from Silicon to Package, and linking to Platform to System and Cloud.
- Deliver SIPI solutions that meet the HPC demands across the entire system.
- Drive future power and signal integrity solutions for chiplet architecture with advanced packaging and advanced silicon nodes.
- Design, model, and simulate SI and PI (i.e., incl. IP design, voltage regulator, motherboard, CPU package, silicon, and decoupling capacitor solution) for data center processors and corresponding platforms to ensure optimized performance. Performs DC, AC and transient simulation to provide noise, impedance profile of the whole power delivery path and link/electrical simulations to validate I/O performance from platform to silicon.
- Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
- Drives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines.
- Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.